Product Fillter

Model: ENTRON-EXX

Sputtering System

The ENTRON-EXX is a versatile, multi-chamber platform designed to support the production of a wide variety of cutting-edge products, including semiconductor logic, memory (DRAM, NAND, next-generation non-volatile memory), and packaging. By integrating a variety of process modules̶such as PVD, pre-clean, heating, cooling̶with enhanced data collection and analysis capabilities, the ENTRON-EXX provides customers with an optimized environment for both development and mass production.

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Features

  • Offers two versatile platform options, Single and Tandem*, enabling customers to select the best platform to fit their factory spaces, thereby achieving maximum productivity per unit of space.
  • Enables quick module additions and swaps, providing flexibility to adapt to changing needs.
  • Capable of accommodating up to 12 modules (PVD, pre-clean, heating, cooling).
  • Enhanced data collection and analysis capabilities to improve yield, support preventive maintenance, and drive operational efficiency.

*A Single platform features a single transfer chamber (Core), offering a simple and space-efficient design. A Tandem platform features two transfer chambers (Cores) arranged in sequence, ideal for complex processes that require higher productivity.

Applications

  • Fabrication of semiconductors: Logic, DRAM, NAND, NVM
    Deposition processes for semiconductor fabrication, including metal interconnects, patterning masks, electrodes, and other functional films.

Product Introduction Video